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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Effect of Al addition in Sn-Ag solder on the interfacial reactions with Cu and ENIG metallizations

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dc.contributor.authorJee, YK-
dc.contributor.authorXia, YH-
dc.contributor.authorYu, Jin-
dc.contributor.authorKang, HW-
dc.contributor.authorLee, TY-
dc.date.accessioned2013-03-25T23:54:46Z-
dc.date.available2013-03-25T23:54:46Z-
dc.date.created2012-02-06-
dc.date.issued2008-05-27-
dc.identifier.citation58th Electronic Components and Technology Conference, ECTC 2008, v., no., pp.491 - 494-
dc.identifier.issn0569-5503-
dc.identifier.urihttp://hdl.handle.net/10203/156208-
dc.languageENG-
dc.titleEffect of Al addition in Sn-Ag solder on the interfacial reactions with Cu and ENIG metallizations-
dc.typeConference-
dc.identifier.scopusid2-s2.0-51349095281-
dc.type.rimsCONF-
dc.citation.beginningpage491-
dc.citation.endingpage494-
dc.citation.publicationname58th Electronic Components and Technology Conference, ECTC 2008-
dc.identifier.conferencecountryUnited States-
dc.identifier.conferencecountryUnited States-
dc.contributor.localauthorYu, Jin-
dc.contributor.nonIdAuthorJee, YK-
dc.contributor.nonIdAuthorXia, YH-
dc.contributor.nonIdAuthorKang, HW-
dc.contributor.nonIdAuthorLee, TY-
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MS-Conference Papers(학술회의논문)
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