The effects of Ag, Cu compositions and Zn doping on the electromigration performance of pb-free solders
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lu M. | - |
| dc.contributor.author | Shih D.-Y. | - |
| dc.contributor.author | Lauro P. | - |
| dc.contributor.author | Kang S. | - |
| dc.contributor.author | Goldsmith C. | - |
| dc.contributor.author | Seo S.-K. | - |
| dc.date.accessioned | 2013-03-19T04:36:22Z | - |
| dc.date.available | 2013-03-19T04:36:22Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2009-05-26 | - |
| dc.identifier.citation | 2009 59th Electronic Components and Technology Conference, ECTC 2009, v., no., pp.922 - 929 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/155828 | - |
| dc.language | ENG | - |
| dc.title | The effects of Ag, Cu compositions and Zn doping on the electromigration performance of pb-free solders | - |
| dc.type | Conference | - |
| dc.identifier.scopusid | 2-s2.0-70349372637 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 922 | - |
| dc.citation.endingpage | 929 | - |
| dc.citation.publicationname | 2009 59th Electronic Components and Technology Conference, ECTC 2009 | - |
| dc.identifier.conferencecountry | United States | - |
| dc.identifier.conferencecountry | United States | - |
| dc.contributor.localauthor | Seo S.-K. | - |
| dc.contributor.nonIdAuthor | Lu M. | - |
| dc.contributor.nonIdAuthor | Shih D.-Y. | - |
| dc.contributor.nonIdAuthor | Lauro P. | - |
| dc.contributor.nonIdAuthor | Kang S. | - |
| dc.contributor.nonIdAuthor | Goldsmith C. | - |
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