The effects of the degree of cure of anisotropic conductive films (ACFs) on the contraction stress build-up of ACFs and ACF joints stability for chip-on-flex (COF) applications
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Chung, CK | ko |
| dc.contributor.author | Paik, Kyung-Wook | ko |
| dc.date.accessioned | 2013-03-19T04:29:51Z | - |
| dc.date.available | 2013-03-19T04:29:51Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2009-05-26 | - |
| dc.identifier.citation | 2009 59th Electronic Components and Technology Conference, ECTC 2009, pp.161 - 167 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/155760 | - |
| dc.language | English | - |
| dc.publisher | 123 | - |
| dc.title | The effects of the degree of cure of anisotropic conductive films (ACFs) on the contraction stress build-up of ACFs and ACF joints stability for chip-on-flex (COF) applications | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000271288900024 | - |
| dc.identifier.scopusid | 2-s2.0-70349680465 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 161 | - |
| dc.citation.endingpage | 167 | - |
| dc.citation.publicationname | 2009 59th Electronic Components and Technology Conference, ECTC 2009 | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | San Diego, CA | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Chung, CK | - |
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