DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, I | - |
dc.contributor.author | Jang, KW | - |
dc.contributor.author | Son, HY | - |
dc.contributor.author | Kim, JH | - |
dc.contributor.author | Paik, Kyung-Wook | - |
dc.date.accessioned | 2013-03-19T03:07:18Z | - |
dc.date.available | 2013-03-19T03:07:18Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2008-05-27 | - |
dc.identifier.citation | 2008 58th Electronic Components and Technology Conference, ECTC, v., no., pp.219 - 224 | - |
dc.identifier.issn | 0569-5503 | - |
dc.identifier.uri | http://hdl.handle.net/10203/155146 | - |
dc.language | ENG | - |
dc.title | Wafer level packages (WLPs) using anisotropic conductive adhesives (ACAs) solution for flip-chip interconnections | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-51349085640 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 219 | - |
dc.citation.endingpage | 224 | - |
dc.citation.publicationname | 2008 58th Electronic Components and Technology Conference, ECTC | - |
dc.identifier.conferencecountry | United States | - |
dc.identifier.conferencecountry | United States | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.nonIdAuthor | Kim, I | - |
dc.contributor.nonIdAuthor | Jang, KW | - |
dc.contributor.nonIdAuthor | Son, HY | - |
dc.contributor.nonIdAuthor | Kim, JH | - |
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