Comparison of electromigration performance for Pb-free solders and surface finishes with Ni UBM

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dc.contributor.authorLu M.-
dc.contributor.authorLauro P.-
dc.contributor.authorShih D.-Y.-
dc.contributor.authorPolastre R.-
dc.contributor.authorGoldsmith C.-
dc.contributor.authorHenderson D.W.-
dc.contributor.authorZhang H.-
dc.contributor.authorCho M.G.-
dc.date.accessioned2013-03-19T01:58:38Z-
dc.date.available2013-03-19T01:58:38Z-
dc.date.created2012-02-06-
dc.date.issued2008-05-27-
dc.identifier.citation2008 58th Electronic Components and Technology Conference, ECTC, v., no., pp.360 - 365-
dc.identifier.issn0569-5503-
dc.identifier.urihttp://hdl.handle.net/10203/154706-
dc.languageENG-
dc.titleComparison of electromigration performance for Pb-free solders and surface finishes with Ni UBM-
dc.typeConference-
dc.identifier.scopusid2-s2.0-51349136376-
dc.type.rimsCONF-
dc.citation.beginningpage360-
dc.citation.endingpage365-
dc.citation.publicationname2008 58th Electronic Components and Technology Conference, ECTC-
dc.identifier.conferencecountryUnited States-
dc.identifier.conferencecountryUnited States-
dc.contributor.localauthorCho M.G.-
dc.contributor.nonIdAuthorLu M.-
dc.contributor.nonIdAuthorLauro P.-
dc.contributor.nonIdAuthorShih D.-Y.-
dc.contributor.nonIdAuthorPolastre R.-
dc.contributor.nonIdAuthorGoldsmith C.-
dc.contributor.nonIdAuthorHenderson D.W.-
dc.contributor.nonIdAuthorZhang H.-
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