Effect of Sb addition in Sn-Ag-Cu solder balls on the drop test reliability of BGA packages with Electroless Nickel Immersion Gold (ENIG) surface finish
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Park, YS | ko |
| dc.contributor.author | Kwon, YM | ko |
| dc.contributor.author | Son, HY | ko |
| dc.contributor.author | Moon, JT | ko |
| dc.contributor.author | Jeong, BW | ko |
| dc.contributor.author | Kang, KI | ko |
| dc.contributor.author | Paik, Kyung-Wook | ko |
| dc.date.accessioned | 2013-03-19T01:23:24Z | - |
| dc.date.available | 2013-03-19T01:23:24Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2007-11-19 | - |
| dc.identifier.citation | The 9th International Conference on Electronic Materials and Packaging, EMAP 2007, pp.0 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/154438 | - |
| dc.language | English | - |
| dc.publisher | 123 | - |
| dc.title | Effect of Sb addition in Sn-Ag-Cu solder balls on the drop test reliability of BGA packages with Electroless Nickel Immersion Gold (ENIG) surface finish | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000259300000044 | - |
| dc.identifier.scopusid | 2-s2.0-51249103624 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 0 | - |
| dc.citation.endingpage | 0 | - |
| dc.citation.publicationname | The 9th International Conference on Electronic Materials and Packaging, EMAP 2007 | - |
| dc.identifier.conferencecountry | KO | - |
| dc.identifier.conferencelocation | Daejeon | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Park, YS | - |
| dc.contributor.nonIdAuthor | Kwon, YM | - |
| dc.contributor.nonIdAuthor | Son, HY | - |
| dc.contributor.nonIdAuthor | Moon, JT | - |
| dc.contributor.nonIdAuthor | Jeong, BW | - |
| dc.contributor.nonIdAuthor | Kang, KI | - |
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