DSpace at KOASAS
College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Comparative study of drop reliability between Cu and Ni(P)/Au UBM with Sn-3.5Ag-xZn solders

Cited 2 time in webofscience Cited 0 time in scopus
  • Hit : 307
  • Download : 0
Export
DC FieldValueLanguage
dc.contributor.authorJee, YKko
dc.contributor.authorKo, YHko
dc.contributor.authorYu, Jinko
dc.contributor.authorLee, TYko
dc.contributor.authorCho, MKko
dc.contributor.authorLee, HMko
dc.date.accessioned2013-03-19T01:19:53Z-
dc.date.available2013-03-19T01:19:53Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2007-05-29-
dc.identifier.citation57th Electronic Components and Technology Conference 2007, ECTC '07, pp.957 - 961-
dc.identifier.issn0569-5503-
dc.identifier.urihttp://hdl.handle.net/10203/154419-
dc.languageEnglish-
dc.publisher123-
dc.titleComparative study of drop reliability between Cu and Ni(P)/Au UBM with Sn-3.5Ag-xZn solders-
dc.typeConference-
dc.identifier.wosid000247705500145-
dc.identifier.scopusid2-s2.0-35348901916-
dc.type.rimsCONF-
dc.citation.beginningpage957-
dc.citation.endingpage961-
dc.citation.publicationname57th Electronic Components and Technology Conference 2007, ECTC '07-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationSparks, NV-
dc.contributor.localauthorYu, Jin-
dc.contributor.nonIdAuthorJee, YK-
dc.contributor.nonIdAuthorKo, YH-
dc.contributor.nonIdAuthorLee, TY-
dc.contributor.nonIdAuthorCho, MK-
dc.contributor.nonIdAuthorLee, HM-
Appears in Collection
MS-Conference Papers(학술회의논문)
Files in This Item
There are no files associated with this item.
This item is cited by other documents in WoS
⊙ Detail Information in WoSⓡ Click to see webofscience_button
⊙ Cited 2 items in WoS Click to see citing articles in records_button

Display Simple Item Record

qr_code

  • mendeley

    citeulike

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.


rss_1.0 rss_2.0 atom_1.0