DC Field | Value | Language |
---|---|---|
dc.contributor.author | Jang, KW | ko |
dc.contributor.author | Paik, Kyung-Wook | ko |
dc.date.accessioned | 2013-03-19T00:56:38Z | - |
dc.date.available | 2013-03-19T00:56:38Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2007-11-19 | - |
dc.identifier.citation | The 9th International Conference on Electronic Materials and Packaging 2007, EMAP 2007, pp.0 | - |
dc.identifier.uri | http://hdl.handle.net/10203/154242 | - |
dc.language | English | - |
dc.publisher | 123 | - |
dc.title | Effects of Anisotropic Conductive Film (ACF) viscosity on ACF fillet and moisture-related reliability for Flip-chip-on-board (FCOB) packages | - |
dc.type | Conference | - |
dc.identifier.wosid | 000259300000043 | - |
dc.identifier.scopusid | 2-s2.0-51249121824 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 0 | - |
dc.citation.endingpage | 0 | - |
dc.citation.publicationname | The 9th International Conference on Electronic Materials and Packaging 2007, EMAP 2007 | - |
dc.identifier.conferencecountry | KO | - |
dc.identifier.conferencelocation | Daejeon | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.nonIdAuthor | Jang, KW | - |
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