DC Field | Value | Language |
---|---|---|
dc.contributor.author | Shirazy, SM | - |
dc.contributor.author | Ukaegbu, AI | - |
dc.contributor.author | Kim, DW | - |
dc.contributor.author | Lee, TW | - |
dc.contributor.author | Cho, MH | - |
dc.contributor.author | Kim, SJ | - |
dc.contributor.author | Yoo, BS | - |
dc.contributor.author | Park, HyoHoon | - |
dc.date.accessioned | 2013-03-19T00:47:45Z | - |
dc.date.available | 2013-03-19T00:47:45Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2009-01-26 | - |
dc.identifier.citation | Photonics Packaging, Integration, and Interconnects IX, v.7221, no., pp.0 - 0 | - |
dc.identifier.uri | http://hdl.handle.net/10203/154191 | - |
dc.language | ENG | - |
dc.publisher | SPIE | - |
dc.title | A comparative analysis of short- and long-wavelength multi-chip optical transmitter modules for optical pcb applications | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-66749135870 | - |
dc.type.rims | CONF | - |
dc.citation.volume | 7221 | - |
dc.citation.beginningpage | 0 | - |
dc.citation.endingpage | 0 | - |
dc.citation.publicationname | Photonics Packaging, Integration, and Interconnects IX | - |
dc.identifier.conferencecountry | United States | - |
dc.identifier.conferencecountry | United States | - |
dc.contributor.localauthor | Park, HyoHoon | - |
dc.contributor.nonIdAuthor | Shirazy, SM | - |
dc.contributor.nonIdAuthor | Ukaegbu, AI | - |
dc.contributor.nonIdAuthor | Kim, DW | - |
dc.contributor.nonIdAuthor | Lee, TW | - |
dc.contributor.nonIdAuthor | Cho, MH | - |
dc.contributor.nonIdAuthor | Kim, SJ | - |
dc.contributor.nonIdAuthor | Yoo, BS | - |
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