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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Multi-walled carbon nanotube/nanocrystalline copper nanocomposite film as an interconnect material

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dc.contributor.authorYoo, JJ-
dc.contributor.authorSong, JY-
dc.contributor.authorYu, Jin-
dc.contributor.authorLyeo, HK-
dc.contributor.authorLee, S-
dc.contributor.authorHahn, JH-
dc.date.accessioned2013-03-19T00:37:21Z-
dc.date.available2013-03-19T00:37:21Z-
dc.date.created2012-02-06-
dc.date.issued2008-05-27-
dc.identifier.citation2008 58th Electronic Components and Technology Conference, ECTC, v., no., pp.1282 - 1286-
dc.identifier.issn0569-5503-
dc.identifier.urihttp://hdl.handle.net/10203/154100-
dc.languageENG-
dc.titleMulti-walled carbon nanotube/nanocrystalline copper nanocomposite film as an interconnect material-
dc.typeConference-
dc.identifier.scopusid2-s2.0-51349153025-
dc.type.rimsCONF-
dc.citation.beginningpage1282-
dc.citation.endingpage1286-
dc.citation.publicationname2008 58th Electronic Components and Technology Conference, ECTC-
dc.contributor.localauthorYu, Jin-
dc.contributor.nonIdAuthorYoo, JJ-
dc.contributor.nonIdAuthorSong, JY-
dc.contributor.nonIdAuthorLyeo, HK-
dc.contributor.nonIdAuthorLee, S-
dc.contributor.nonIdAuthorHahn, JH-
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MS-Conference Papers(학술회의논문)
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