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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Bumpless ball grid array (BBGA) package using a solder resist cavity

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dc.contributor.authorKwon, YM-
dc.contributor.authorKang, JS-
dc.contributor.authorKweon, YD-
dc.contributor.authorPaik, Kyung-Wook-
dc.date.accessioned2013-03-19T00:21:42Z-
dc.date.available2013-03-19T00:21:42Z-
dc.date.created2012-02-06-
dc.date.issued2009-05-26-
dc.identifier.citation59th Electronic Components and Technology Conference, 2009, v., no., pp.1552 - 1556-
dc.identifier.urihttp://hdl.handle.net/10203/153989-
dc.languageENG-
dc.titleBumpless ball grid array (BBGA) package using a solder resist cavity-
dc.typeConference-
dc.identifier.scopusid2-s2.0-70349686452-
dc.type.rimsCONF-
dc.citation.beginningpage1552-
dc.citation.endingpage1556-
dc.citation.publicationname59th Electronic Components and Technology Conference, 2009-
dc.identifier.conferencecountryUnited States-
dc.identifier.conferencecountryUnited States-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorKwon, YM-
dc.contributor.nonIdAuthorKang, JS-
dc.contributor.nonIdAuthorKweon, YD-
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MS-Conference Papers(학술회의논문)
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