Wafer to wafer bonding using electroplated Co-Sn solder layer
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, SH | ko |
| dc.contributor.author | Yu, Jin | ko |
| dc.date.accessioned | 2013-03-18T23:35:27Z | - |
| dc.date.available | 2013-03-18T23:35:27Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2008-10-22 | - |
| dc.identifier.citation | 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008, pp.313 - 316 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/153637 | - |
| dc.language | English | - |
| dc.publisher | 123 | - |
| dc.title | Wafer to wafer bonding using electroplated Co-Sn solder layer | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000264237400073 | - |
| dc.identifier.scopusid | 2-s2.0-64049115102 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 313 | - |
| dc.citation.endingpage | 316 | - |
| dc.citation.publicationname | 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008 | - |
| dc.identifier.conferencecountry | CH | - |
| dc.identifier.conferencelocation | Taipei | - |
| dc.contributor.localauthor | Yu, Jin | - |
| dc.contributor.nonIdAuthor | Kim, SH | - |
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