Wafer level packages (WLPs) using pre-applied anisotropic conductive films (ACFs)
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Paik, Kyung-Wook | ko |
| dc.contributor.author | Son, HY | ko |
| dc.contributor.author | Chung, CK | ko |
| dc.date.accessioned | 2013-03-18T23:34:47Z | - |
| dc.date.available | 2013-03-18T23:34:47Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2007-01-15 | - |
| dc.identifier.citation | Polytronic 2007 - 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, pp.153 - 158 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/153633 | - |
| dc.language | English | - |
| dc.publisher | 123 | - |
| dc.title | Wafer level packages (WLPs) using pre-applied anisotropic conductive films (ACFs) | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000250106800033 | - |
| dc.identifier.scopusid | 2-s2.0-49949089649 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 153 | - |
| dc.citation.endingpage | 158 | - |
| dc.citation.publicationname | Polytronic 2007 - 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics | - |
| dc.identifier.conferencecountry | JA | - |
| dc.identifier.conferencelocation | Tokyo | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Son, HY | - |
| dc.contributor.nonIdAuthor | Chung, CK | - |
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