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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Wafer level ACA packages and their applications to advanced electronic packaging

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dc.contributor.authorPaik, Kyung-Wookko
dc.contributor.authorSon, HYko
dc.contributor.authorKim, Iko
dc.contributor.authorChung, CKko
dc.date.accessioned2013-03-18T23:34:27Z-
dc.date.available2013-03-18T23:34:27Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2008-12-09-
dc.identifier.citation10th Electronics Packaging Technology Conference, EPTC 2008, pp.450 - 456-
dc.identifier.urihttp://hdl.handle.net/10203/153631-
dc.languageEnglish-
dc.publisher123-
dc.titleWafer level ACA packages and their applications to advanced electronic packaging-
dc.typeConference-
dc.identifier.wosid000265818600072-
dc.identifier.scopusid2-s2.0-63049127162-
dc.type.rimsCONF-
dc.citation.beginningpage450-
dc.citation.endingpage456-
dc.citation.publicationname10th Electronics Packaging Technology Conference, EPTC 2008-
dc.identifier.conferencecountrySI-
dc.identifier.conferencelocationSingapore-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorSon, HY-
dc.contributor.nonIdAuthorKim, I-
dc.contributor.nonIdAuthorChung, CK-
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MS-Conference Papers(학술회의논문)
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