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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Analytical approach to evaluate shear stress in flip chip interconnection using NCA/ACF

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dc.contributor.authorYang, SY-
dc.contributor.authorKwon, WS-
dc.contributor.authorLee, SB-
dc.contributor.authorPaik Kyung-Wook-
dc.date.accessioned2013-03-18T20:54:14Z-
dc.date.available2013-03-18T20:54:14Z-
dc.date.created2012-06-25-
dc.date.issued2003-11-
dc.identifier.citation5th International Symposium on Electronic Materials and Packagings 2003, v., no., pp. --
dc.identifier.urihttp://hdl.handle.net/10203/152349-
dc.languageENG-
dc.titleAnalytical approach to evaluate shear stress in flip chip interconnection using NCA/ACF-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationname5th International Symposium on Electronic Materials and Packagings 2003-
dc.identifier.conferencecountrySingapore-
dc.contributor.localauthorPaik Kyung-Wook-
dc.contributor.nonIdAuthorYang, SY-
dc.contributor.nonIdAuthorKwon, WS-
dc.contributor.nonIdAuthorLee, SB-
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MS-Conference Papers(학술회의논문)
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