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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Effects of Pd Addition on Au stud Bumps/Al Pads Interfacial Reactions and Bond Reliability

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dc.contributor.authorKim, HJko
dc.contributor.authorCho, JSko
dc.contributor.authorPark, YJko
dc.contributor.authorLee, Jko
dc.contributor.authorPaik Kyung-Wookko
dc.date.accessioned2013-03-18T20:52:51Z-
dc.date.available2013-03-18T20:52:51Z-
dc.date.created2012-06-25-
dc.date.created2012-06-25-
dc.date.issued2004-03-
dc.identifier.citationTMS 2004 133rd Annual Meeting & Exhibition-
dc.identifier.urihttp://hdl.handle.net/10203/152340-
dc.languageEnglish-
dc.publisherTMS-
dc.titleEffects of Pd Addition on Au stud Bumps/Al Pads Interfacial Reactions and Bond Reliability-
dc.typeConference-
dc.identifier.scopusid2-s2.0-7044247940-
dc.type.rimsCONF-
dc.citation.publicationnameTMS 2004 133rd Annual Meeting & Exhibition-
dc.identifier.conferencecountryUS-
dc.contributor.localauthorPaik Kyung-Wook-
dc.contributor.nonIdAuthorKim, HJ-
dc.contributor.nonIdAuthorCho, JS-
dc.contributor.nonIdAuthorPark, YJ-
dc.contributor.nonIdAuthorLee, J-
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MS-Conference Papers(학술회의논문)
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