DC Field | Value | Language |
---|---|---|
dc.contributor.author | Yu, Jin | - |
dc.contributor.author | Kim, JY | - |
dc.contributor.author | Sohn, YC | - |
dc.date.accessioned | 2013-03-18T17:09:06Z | - |
dc.date.available | 2013-03-18T17:09:06Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2005 | - |
dc.identifier.citation | Micro System Technologies 2005 Proceedings, v., no., pp.337 - 344 | - |
dc.identifier.uri | http://hdl.handle.net/10203/150534 | - |
dc.language | ENG | - |
dc.title | Interfacial Reactions between Lead-free Solders and Ni/Cu Dual-layer UBM | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 337 | - |
dc.citation.endingpage | 344 | - |
dc.citation.publicationname | Micro System Technologies 2005 Proceedings | - |
dc.identifier.conferencecountry | Germany | - |
dc.identifier.conferencecountry | Germany | - |
dc.contributor.localauthor | Yu, Jin | - |
dc.contributor.nonIdAuthor | Kim, JY | - |
dc.contributor.nonIdAuthor | Sohn, YC | - |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.