Flip-chip assembly on soft polymer substrate using ACP for integrating readout circuitry for modular expandable tactile sensor array
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Chang S.-I. | - |
| dc.contributor.author | Lee H.-K. | - |
| dc.contributor.author | Yoon E. | - |
| dc.date.accessioned | 2013-03-18T16:12:40Z | - |
| dc.date.available | 2013-03-18T16:12:40Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2005-06-05 | - |
| dc.identifier.citation | 13th International Conference on Solid-State Sensors and Actuators and Microsystems, TRANSDUCERS '05, v.2, no., pp.1969 - 1972 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/150073 | - |
| dc.language | ENG | - |
| dc.title | Flip-chip assembly on soft polymer substrate using ACP for integrating readout circuitry for modular expandable tactile sensor array | - |
| dc.type | Conference | - |
| dc.identifier.scopusid | 2-s2.0-27544453057 | - |
| dc.type.rims | CONF | - |
| dc.citation.volume | 2 | - |
| dc.citation.beginningpage | 1969 | - |
| dc.citation.endingpage | 1972 | - |
| dc.citation.publicationname | 13th International Conference on Solid-State Sensors and Actuators and Microsystems, TRANSDUCERS '05 | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | Yoon E. | - |
| dc.contributor.nonIdAuthor | Chang S.-I. | - |
| dc.contributor.nonIdAuthor | Lee H.-K. | - |
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