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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

열처리에 따른 Sn-3.5Ag 솔더 범프의 전기저항 변화오 미세구조와의 관계

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전덕영researcher / 이정섭 / 주건모
Publisher
한국 마이크로전자 및 패키징 학회
Issue Date
2004
Language
KOR
Citation

2004 한국마이크로전자 및 패키징 학회 추계기술심포지엄, pp.p. 52 -

URI
http://hdl.handle.net/10203/148195
Appears in Collection
MS-Conference Papers(학술회의논문)
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