DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, Hyuck Mo | - |
dc.contributor.author | Jeong, SW | - |
dc.contributor.author | Kim, JH | - |
dc.date.accessioned | 2013-03-18T09:23:59Z | - |
dc.date.available | 2013-03-18T09:23:59Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2004-09-06 | - |
dc.identifier.citation | The 66th World Foundry Congress, v., no., pp.91 - 102 | - |
dc.identifier.uri | http://hdl.handle.net/10203/146964 | - |
dc.language | ENG | - |
dc.title | Effect of Cooling Rates on IMC and Mechanical Properties of Sn-Ag-Cu / Cu Pad | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 91 | - |
dc.citation.endingpage | 102 | - |
dc.citation.publicationname | The 66th World Foundry Congress | - |
dc.identifier.conferencecountry | Turkey | - |
dc.identifier.conferencecountry | Turkey | - |
dc.contributor.localauthor | Lee, Hyuck Mo | - |
dc.contributor.nonIdAuthor | Jeong, SW | - |
dc.contributor.nonIdAuthor | Kim, JH | - |
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