Atomic Layer Deposition of Ruthenium Glue Layer for Copper Damascene interconnect
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kang, Sang-Won | ko |
| dc.date.accessioned | 2013-03-18T06:55:54Z | - |
| dc.date.available | 2013-03-18T06:55:54Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2003-04 | - |
| dc.identifier.citation | 203rd ECS Meeting | - |
| dc.identifier.uri | http://hdl.handle.net/10203/145775 | - |
| dc.language | English | - |
| dc.publisher | ECS | - |
| dc.title | Atomic Layer Deposition of Ruthenium Glue Layer for Copper Damascene interconnect | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000186210500021 | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | 203rd ECS Meeting | - |
| dc.identifier.conferencecountry | FR | - |
| dc.identifier.conferencelocation | Palais des Congres de Paris | - |
| dc.contributor.localauthor | Kang, Sang-Won | - |
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