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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Effects of current density on electromigration-induced failure in flip chip composite solder joints at room temperature

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dc.contributor.authorNah, JW-
dc.contributor.authorSuh, JO-
dc.contributor.authorPaik, Kyung-Wook-
dc.contributor.authorTu, KN-
dc.date.accessioned2013-03-17T22:47:32Z-
dc.date.available2013-03-17T22:47:32Z-
dc.date.created2012-02-06-
dc.date.issued2005-03-16-
dc.identifier.citation2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, v.2005, no., pp.50 - 53-
dc.identifier.urihttp://hdl.handle.net/10203/142570-
dc.languageENG-
dc.titleEffects of current density on electromigration-induced failure in flip chip composite solder joints at room temperature-
dc.typeConference-
dc.identifier.scopusid2-s2.0-33746533073-
dc.type.rimsCONF-
dc.citation.volume2005-
dc.citation.beginningpage50-
dc.citation.endingpage53-
dc.citation.publicationname2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces-
dc.identifier.conferencecountryUnited States-
dc.identifier.conferencecountryUnited States-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorNah, JW-
dc.contributor.nonIdAuthorSuh, JO-
dc.contributor.nonIdAuthorTu, KN-
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MS-Conference Papers(학술회의논문)
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