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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Thermodynamic issues of lead-free soldering in electronic packaging

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dc.contributor.authorJeong, SW-
dc.contributor.authorKim, JH-
dc.contributor.authorLee, Hyuck Mo-
dc.date.accessioned2013-03-17T08:51:26Z-
dc.date.available2013-03-17T08:51:26Z-
dc.date.created2012-02-06-
dc.date.issued2003-07-07-
dc.identifier.citationThermec 2003 Processing and Manufacturing of Advanced Materials, v., no.5, pp.4081 - 4086-
dc.identifier.issn0255-5476-
dc.identifier.urihttp://hdl.handle.net/10203/141764-
dc.languageENG-
dc.titleThermodynamic issues of lead-free soldering in electronic packaging-
dc.typeConference-
dc.identifier.scopusid2-s2.0-0038337983-
dc.type.rimsCONF-
dc.citation.issue5-
dc.citation.beginningpage4081-
dc.citation.endingpage4086-
dc.citation.publicationnameThermec 2003 Processing and Manufacturing of Advanced Materials-
dc.identifier.conferencecountrySpain-
dc.identifier.conferencecountrySpain-
dc.contributor.localauthorLee, Hyuck Mo-
dc.contributor.nonIdAuthorJeong, SW-
dc.contributor.nonIdAuthorKim, JH-
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MS-Conference Papers(학술회의논문)
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