DC Field | Value | Language |
---|---|---|
dc.contributor.author | Chung, CK | ko |
dc.contributor.author | Paik, Kyung-Wook | ko |
dc.date.accessioned | 2007-09-11T06:18:34Z | - |
dc.date.available | 2007-09-11T06:18:34Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2007-05-29 | - |
dc.identifier.citation | 57th Electronic Components and Technology Conference 2007, ECTC '07, pp.1831 - 1838 | - |
dc.identifier.issn | 0569-5503 | - |
dc.identifier.uri | http://hdl.handle.net/10203/1415 | - |
dc.language | English | - |
dc.language.iso | en_US | en |
dc.publisher | IEEE | - |
dc.title | Non-Conductive Films (NCFs) with multi-functional epoxies and silica fillers for reliable NCFs Flip Chip on Organic Boards (FCOB) | - |
dc.type | Conference | - |
dc.identifier.wosid | 000247705500279 | - |
dc.identifier.scopusid | 2-s2.0-35348871203 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 1831 | - |
dc.citation.endingpage | 1838 | - |
dc.citation.publicationname | 57th Electronic Components and Technology Conference 2007, ECTC '07 | - |
dc.identifier.conferencecountry | US | - |
dc.identifier.conferencelocation | Sparks, NV | - |
dc.embargo.liftdate | 9999-12-31 | - |
dc.embargo.terms | 9999-12-31 | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.nonIdAuthor | Chung, CK | - |
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