DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kwon, WS | - |
dc.contributor.author | Paik, Kyung-Wook | - |
dc.date.accessioned | 2013-03-17T07:46:43Z | - |
dc.date.available | 2013-03-17T07:46:43Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2005-03-16 | - |
dc.identifier.citation | 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, v.2005, no., pp.214 - 220 | - |
dc.identifier.uri | http://hdl.handle.net/10203/141266 | - |
dc.language | ENG | - |
dc.title | Conduction mechanism of Anisotropic Conductive Adhesives (ACAs): Conductor ball deformation and build-up of contraction stresses | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-33746523461 | - |
dc.type.rims | CONF | - |
dc.citation.volume | 2005 | - |
dc.citation.beginningpage | 214 | - |
dc.citation.endingpage | 220 | - |
dc.citation.publicationname | 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces | - |
dc.identifier.conferencecountry | United States | - |
dc.identifier.conferencecountry | United States | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.nonIdAuthor | Kwon, WS | - |
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