Effects of heating rate during ACFs curing process on material properties and thermal cycling reliability of flip chip assembly
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Jang, KW | - |
| dc.contributor.author | Paik, Kyung-Wook | - |
| dc.date.accessioned | 2007-09-11T06:09:48Z | - |
| dc.date.available | 2007-09-11T06:09:48Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2007-05-29 | - |
| dc.identifier.citation | 57th Electronic Components and Technology Conference, 2007, v., no., pp.1725 - 1730 | - |
| dc.identifier.issn | 0569-5503 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/1411 | - |
| dc.language | ENG | - |
| dc.language.iso | en_US | en |
| dc.publisher | IEEE | - |
| dc.title | Effects of heating rate during ACFs curing process on material properties and thermal cycling reliability of flip chip assembly | - |
| dc.type | Conference | - |
| dc.identifier.scopusid | 2-s2.0-35348903749 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 1725 | - |
| dc.citation.endingpage | 1730 | - |
| dc.citation.publicationname | 57th Electronic Components and Technology Conference, 2007 | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Jang, KW | - |
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