Electromigration of Pb-free solder flip chip using electroless Ni-P/Au UBM
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kwon, YM | ko |
| dc.contributor.author | Paik, Kyung-Wook | ko |
| dc.date.accessioned | 2007-09-11T06:05:20Z | - |
| dc.date.available | 2007-09-11T06:05:20Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2007-05-29 | - |
| dc.identifier.citation | 57th Electronic Components and Technology Conference, ECTC '07, pp.1472 - 1477 | - |
| dc.identifier.issn | 0569-5503 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/1410 | - |
| dc.language | English | - |
| dc.language.iso | en_US | en |
| dc.publisher | IEEE | - |
| dc.title | Electromigration of Pb-free solder flip chip using electroless Ni-P/Au UBM | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000247705500223 | - |
| dc.identifier.scopusid | 2-s2.0-35348845707 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 1472 | - |
| dc.citation.endingpage | 1477 | - |
| dc.citation.publicationname | 57th Electronic Components and Technology Conference, ECTC '07 | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | Sparks, NV | - |
| dc.embargo.liftdate | 9999-12-31 | - |
| dc.embargo.terms | 9999-12-31 | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Kwon, YM | - |
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