DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, HJ | - |
dc.contributor.author | Yu, Jin | - |
dc.contributor.author | Lee, TY | - |
dc.date.accessioned | 2013-03-17T06:59:20Z | - |
dc.date.available | 2013-03-17T06:59:20Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2003-11-18 | - |
dc.identifier.citation | 2003 International Symposium on Microelectronics, v.5288, no., pp.363 - 367 | - |
dc.identifier.uri | http://hdl.handle.net/10203/140886 | - |
dc.language | ENG | - |
dc.title | New Manufacturing Process for Flexible Printed Circuit Board (PCB) with Cu Conductive Lines of 5 μm pitch | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-2342617612 | - |
dc.type.rims | CONF | - |
dc.citation.volume | 5288 | - |
dc.citation.beginningpage | 363 | - |
dc.citation.endingpage | 367 | - |
dc.citation.publicationname | 2003 International Symposium on Microelectronics | - |
dc.identifier.conferencecountry | United States | - |
dc.identifier.conferencecountry | United States | - |
dc.contributor.localauthor | Yu, Jin | - |
dc.contributor.nonIdAuthor | Lee, HJ | - |
dc.contributor.nonIdAuthor | Lee, TY | - |
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