DC Field | Value | Language |
---|---|---|
dc.contributor.author | Nah, JW | ko |
dc.contributor.author | Paik, Kyung-Wook | ko |
dc.contributor.author | Cho, SJ | ko |
dc.contributor.author | Kim, WH | ko |
dc.date.accessioned | 2007-09-11T06:00:31Z | - |
dc.date.available | 2007-09-11T06:00:31Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2003-05-27 | - |
dc.identifier.citation | 53rd Electronic Components and Technology Conference, pp.244 - 249 | - |
dc.identifier.issn | 0569-5503 | - |
dc.identifier.uri | http://hdl.handle.net/10203/1407 | - |
dc.description.sponsorship | This work was funded by Samsung Electro-Mechanics Co. LTD in Korea. This work was also supported in part by Center for Electronic Packaging Materials of Korea Science and Engineering Foundation. | en |
dc.language | English | - |
dc.language.iso | en_US | en |
dc.publisher | IEEE | - |
dc.title | Flip chip assembly on PCB substrates with coined solder bumps | - |
dc.type | Conference | - |
dc.identifier.wosid | 000183448100037 | - |
dc.identifier.scopusid | 2-s2.0-0037674970 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 244 | - |
dc.citation.endingpage | 249 | - |
dc.citation.publicationname | 53rd Electronic Components and Technology Conference | - |
dc.identifier.conferencecountry | US | - |
dc.identifier.conferencelocation | New Orleans LA | - |
dc.embargo.liftdate | 9999-12-31 | - |
dc.embargo.terms | 9999-12-31 | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.nonIdAuthor | Nah, JW | - |
dc.contributor.nonIdAuthor | Cho, SJ | - |
dc.contributor.nonIdAuthor | Kim, WH | - |
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