Development of 3-dimensional memory die stack packages using polymer insulated sidewall technique
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Paik, Kyung-Wook | ko |
| dc.date.accessioned | 2007-09-11T05:57:06Z | - |
| dc.date.available | 2007-09-11T05:57:06Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1999-06-01 | - |
| dc.identifier.citation | 49th Electronic Components and Technology Conference, pp.0 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/1405 | - |
| dc.language | English | - |
| dc.language.iso | en_US | en |
| dc.publisher | IEEE | - |
| dc.title | Development of 3-dimensional memory die stack packages using polymer insulated sidewall technique | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000081460000110 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 0 | - |
| dc.citation.endingpage | 0 | - |
| dc.citation.publicationname | 49th Electronic Components and Technology Conference | - |
| dc.identifier.conferencecountry | US | - |
| dc.embargo.liftdate | 9999-12-31 | - |
| dc.embargo.terms | 9999-12-31 | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
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