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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

A comparative study of ENIG and Cu OSP surface finishes on the mechanical reliability of Sn-3.0Ag-0.5Cu and Sn-36.8Pb-0.4Ag solders

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dc.contributor.authorJee, YK-
dc.contributor.authorSohn, YC-
dc.contributor.authorYu, Jin-
dc.contributor.authorLee, TY-
dc.contributor.authorSeo, HN-
dc.contributor.authorKim, KH-
dc.contributor.authorAhn, JH-
dc.contributor.authorLee, YM-
dc.date.accessioned2013-03-17T06:00:14Z-
dc.date.available2013-03-17T06:00:14Z-
dc.date.created2012-02-06-
dc.date.issued2006-12-11-
dc.identifier.citation2006 International Conference on Electronic Materials and Packaging, EMAP, v., no., pp.571 - 579-
dc.identifier.urihttp://hdl.handle.net/10203/140455-
dc.languageENG-
dc.titleA comparative study of ENIG and Cu OSP surface finishes on the mechanical reliability of Sn-3.0Ag-0.5Cu and Sn-36.8Pb-0.4Ag solders-
dc.typeConference-
dc.identifier.scopusid2-s2.0-51449095534-
dc.type.rimsCONF-
dc.citation.beginningpage571-
dc.citation.endingpage579-
dc.citation.publicationname2006 International Conference on Electronic Materials and Packaging, EMAP-
dc.identifier.conferencecountryHong Kong-
dc.identifier.conferencecountryHong Kong-
dc.contributor.localauthorYu, Jin-
dc.contributor.nonIdAuthorJee, YK-
dc.contributor.nonIdAuthorSohn, YC-
dc.contributor.nonIdAuthorLee, TY-
dc.contributor.nonIdAuthorSeo, HN-
dc.contributor.nonIdAuthorKim, KH-
dc.contributor.nonIdAuthorAhn, JH-
dc.contributor.nonIdAuthorLee, YM-
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