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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Effect of intermetallics spalling on the mechanical behavior of electroless Ni(P)/Pb-free solder interconnection

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dc.contributor.authorSohn, YC-
dc.contributor.authorYu, Jin-
dc.contributor.authorKang, SK-
dc.contributor.authorShih, DY-
dc.contributor.authorLee, TY-
dc.date.accessioned2013-03-17T03:36:05Z-
dc.date.available2013-03-17T03:36:05Z-
dc.date.created2012-02-06-
dc.date.issued2005-05-31-
dc.identifier.citation55th Electronic Components and Technology Conference, ECTC 2005, v.1, no., pp.83 - 88-
dc.identifier.issn0569-5503-
dc.identifier.urihttp://hdl.handle.net/10203/139458-
dc.languageENG-
dc.titleEffect of intermetallics spalling on the mechanical behavior of electroless Ni(P)/Pb-free solder interconnection-
dc.typeConference-
dc.identifier.scopusid2-s2.0-24644446070-
dc.type.rimsCONF-
dc.citation.volume1-
dc.citation.beginningpage83-
dc.citation.endingpage88-
dc.citation.publicationname55th Electronic Components and Technology Conference, ECTC 2005-
dc.identifier.conferencecountryUnited States-
dc.identifier.conferencecountryUnited States-
dc.contributor.localauthorYu, Jin-
dc.contributor.nonIdAuthorSohn, YC-
dc.contributor.nonIdAuthorKang, SK-
dc.contributor.nonIdAuthorShih, DY-
dc.contributor.nonIdAuthorLee, TY-
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MS-Conference Papers(학술회의논문)
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