Effect of intermetallics spalling on the mechanical behavior of electroless Ni(P)/Pb-free solder interconnection
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Sohn, YC | - |
| dc.contributor.author | Yu, Jin | - |
| dc.contributor.author | Kang, SK | - |
| dc.contributor.author | Shih, DY | - |
| dc.contributor.author | Lee, TY | - |
| dc.date.accessioned | 2013-03-17T03:36:05Z | - |
| dc.date.available | 2013-03-17T03:36:05Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2005-05-31 | - |
| dc.identifier.citation | 55th Electronic Components and Technology Conference, ECTC 2005, v.1, no., pp.83 - 88 | - |
| dc.identifier.issn | 0569-5503 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/139458 | - |
| dc.language | ENG | - |
| dc.title | Effect of intermetallics spalling on the mechanical behavior of electroless Ni(P)/Pb-free solder interconnection | - |
| dc.type | Conference | - |
| dc.identifier.scopusid | 2-s2.0-24644446070 | - |
| dc.type.rims | CONF | - |
| dc.citation.volume | 1 | - |
| dc.citation.beginningpage | 83 | - |
| dc.citation.endingpage | 88 | - |
| dc.citation.publicationname | 55th Electronic Components and Technology Conference, ECTC 2005 | - |
| dc.identifier.conferencecountry | United States | - |
| dc.identifier.conferencecountry | United States | - |
| dc.contributor.localauthor | Yu, Jin | - |
| dc.contributor.nonIdAuthor | Sohn, YC | - |
| dc.contributor.nonIdAuthor | Kang, SK | - |
| dc.contributor.nonIdAuthor | Shih, DY | - |
| dc.contributor.nonIdAuthor | Lee, TY | - |
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