DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kwon, WS | - |
dc.contributor.author | Paik, Kyung-Wook | - |
dc.date.accessioned | 2013-03-17T03:02:03Z | - |
dc.date.available | 2013-03-17T03:02:03Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2003-07-06 | - |
dc.identifier.citation | 2003 International Electronic Packaging Technical Conference and Exhibition, v.1, no., pp.131 - 136 | - |
dc.identifier.uri | http://hdl.handle.net/10203/139188 | - |
dc.language | ENG | - |
dc.title | Experimental Analysis of Compressive Stresses in ACF Flip Chip Joint and Its Influence on ACF Joint Reliability | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-1242264771 | - |
dc.type.rims | CONF | - |
dc.citation.volume | 1 | - |
dc.citation.beginningpage | 131 | - |
dc.citation.endingpage | 136 | - |
dc.citation.publicationname | 2003 International Electronic Packaging Technical Conference and Exhibition | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.nonIdAuthor | Kwon, WS | - |
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