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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

Selectively anodized aluminum substrates for microwave power module package

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dc.contributor.authorShin S.-H.-
dc.contributor.authorKwon, Young Se-
dc.date.accessioned2013-03-17T02:07:49Z-
dc.date.available2013-03-17T02:07:49Z-
dc.date.created2012-02-06-
dc.date.issued2005-05-31-
dc.identifier.citation55th Electronic Components and Technology Conference, ECTC, v.2, no., pp.1904 - 1908-
dc.identifier.issn0569-5503-
dc.identifier.urihttp://hdl.handle.net/10203/138688-
dc.languageENG-
dc.titleSelectively anodized aluminum substrates for microwave power module package-
dc.typeConference-
dc.identifier.scopusid2-s2.0-24644480273-
dc.type.rimsCONF-
dc.citation.volume2-
dc.citation.beginningpage1904-
dc.citation.endingpage1908-
dc.citation.publicationname55th Electronic Components and Technology Conference, ECTC-
dc.identifier.conferencecountryUnited States-
dc.identifier.conferencecountryUnited States-
dc.contributor.localauthorKwon, Young Se-
dc.contributor.nonIdAuthorShin S.-H.-
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EE-Conference Papers(학술회의논문)
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