DC Field | Value | Language |
---|---|---|
dc.contributor.author | Chung, CK | - |
dc.contributor.author | Kwon, WS | - |
dc.contributor.author | Park, JH | - |
dc.contributor.author | Lee, Soon-Bok | - |
dc.contributor.author | Paik, Kyung-Wook | - |
dc.date.accessioned | 2013-03-17T01:53:48Z | - |
dc.date.available | 2013-03-17T01:53:48Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2005-12-11 | - |
dc.identifier.citation | International Symposium on Electronics Materials and Packaging, 2005, v.2005, no., pp.156 - 161 | - |
dc.identifier.uri | http://hdl.handle.net/10203/138560 | - |
dc.language | ENG | - |
dc.title | Effects of the functional groups of non-conductive films (NCFs) on materials properties and reliability of NCF flip-chip-on-organic boards | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-33847334704 | - |
dc.type.rims | CONF | - |
dc.citation.volume | 2005 | - |
dc.citation.beginningpage | 156 | - |
dc.citation.endingpage | 161 | - |
dc.citation.publicationname | International Symposium on Electronics Materials and Packaging, 2005 | - |
dc.identifier.conferencecountry | Japan | - |
dc.identifier.conferencecountry | Japan | - |
dc.contributor.localauthor | Lee, Soon-Bok | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.nonIdAuthor | Chung, CK | - |
dc.contributor.nonIdAuthor | Kwon, WS | - |
dc.contributor.nonIdAuthor | Park, JH | - |
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