DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Joungho | ko |
dc.contributor.author | Jeong, Youchul | ko |
dc.contributor.author | Kim, Hyungsoo | ko |
dc.contributor.author | Kim, Jingook | ko |
dc.contributor.author | Park, Jongbae | ko |
dc.date.accessioned | 2013-03-17T01:09:55Z | - |
dc.date.available | 2013-03-17T01:09:55Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2002-10 | - |
dc.identifier.citation | IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging, pp.179 - 183 | - |
dc.identifier.uri | http://hdl.handle.net/10203/138160 | - |
dc.language | English | - |
dc.publisher | IEEE | - |
dc.title | An Efficient Hybrid Transmission Line Method (HTLM) for Analysis of Perforated Package Power/Ground Plane | - |
dc.type | Conference | - |
dc.identifier.wosid | 000179397600039 | - |
dc.identifier.scopusid | 2-s2.0-84948742760 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 179 | - |
dc.citation.endingpage | 183 | - |
dc.citation.publicationname | IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging | - |
dc.identifier.conferencecountry | US | - |
dc.identifier.conferencelocation | California | - |
dc.contributor.localauthor | Kim, Joungho | - |
dc.contributor.nonIdAuthor | Jeong, Youchul | - |
dc.contributor.nonIdAuthor | Kim, Hyungsoo | - |
dc.contributor.nonIdAuthor | Kim, Jingook | - |
dc.contributor.nonIdAuthor | Park, Jongbae | - |
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