The Solder Joint and Runner Metal Reliability of Wafer-Level CSP
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 유진 | - |
| dc.date.accessioned | 2013-03-16T22:52:47Z | - |
| dc.date.available | 2013-03-16T22:52:47Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2000-05 | - |
| dc.identifier.citation | 50th Electronic Components and Technology Conference, v.0, no.0, pp.87 - 92 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/136907 | - |
| dc.language | KOR | - |
| dc.publisher | 50th Electronic Components and Technology Conference | - |
| dc.title | The Solder Joint and Runner Metal Reliability of Wafer-Level CSP | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.volume | 0 | - |
| dc.citation.issue | 0 | - |
| dc.citation.beginningpage | 87 | - |
| dc.citation.endingpage | 92 | - |
| dc.citation.publicationname | 50th Electronic Components and Technology Conference | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | 유진 | - |
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