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College of Engineering(공과대학)Dept. of Bio and Brain Engineering(바이오및뇌공학과)BiS-Conference Papers(학술회의논문)

Near-Field Electromagnetic Shielding Effect of On-Chip Electroplated Copper Layers

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dc.contributor.authorKang, Tae Goo-
dc.contributor.authorCho, Young-Ho-
dc.date.accessioned2013-03-16T22:42:18Z-
dc.date.available2013-03-16T22:42:18Z-
dc.date.created2012-02-06-
dc.date.issued1999-11-14-
dc.identifier.citationInter. Mechanical Engineering Congress and Exposition (IMECE '99), v., no., pp.541 - 544-
dc.identifier.urihttp://hdl.handle.net/10203/136810-
dc.languageENG-
dc.titleNear-Field Electromagnetic Shielding Effect of On-Chip Electroplated Copper Layers-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.beginningpage541-
dc.citation.endingpage544-
dc.citation.publicationnameInter. Mechanical Engineering Congress and Exposition (IMECE '99)-
dc.identifier.conferencecountryUnited States-
dc.identifier.conferencecountryUnited States-
dc.contributor.localauthorCho, Young-Ho-
dc.contributor.nonIdAuthorKang, Tae Goo-
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BiS-Conference Papers(학술회의논문)
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