Investigation of Plane-to-Plane Noise Coupling through Cutout in Multi-layer Power/Ground Planes
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Joungho | ko |
| dc.contributor.author | Lee, Junwoo | ko |
| dc.contributor.author | Seng, Yeo Mui | ko |
| dc.contributor.author | Iyer, Mahadevan K | ko |
| dc.date.accessioned | 2013-03-16T21:19:14Z | - |
| dc.date.available | 2013-03-16T21:19:14Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2002-12 | - |
| dc.identifier.citation | IEEE 4th Electronics Packaging Technology Conference, pp.257 - 260 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/135998 | - |
| dc.language | English | - |
| dc.publisher | IEEE | - |
| dc.title | Investigation of Plane-to-Plane Noise Coupling through Cutout in Multi-layer Power/Ground Planes | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000181924100048 | - |
| dc.identifier.scopusid | 2-s2.0-84964595998 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 257 | - |
| dc.citation.endingpage | 260 | - |
| dc.citation.publicationname | IEEE 4th Electronics Packaging Technology Conference | - |
| dc.identifier.conferencecountry | SI | - |
| dc.contributor.localauthor | Kim, Joungho | - |
| dc.contributor.nonIdAuthor | Lee, Junwoo | - |
| dc.contributor.nonIdAuthor | Seng, Yeo Mui | - |
| dc.contributor.nonIdAuthor | Iyer, Mahadevan K | - |
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