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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

전자 패키지에 사용되는 Cu/Cr/폴리이미드 테이프의 T-필 테스트에ㅡ대한 연구

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유진researcher / Song, JY
Issue Date
2001
Language
KOR
Citation

제 15회 강도 심포지엄, pp.341 - 355

URI
http://hdl.handle.net/10203/134968
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MS-Conference Papers(학술회의논문)
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