Thermo-Mechanical Reliability of the Benzocyclobutane(BCB) film in a WLCSP Process
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Yu, Jin | - |
| dc.contributor.author | Lee, KO | - |
| dc.contributor.author | Kim, JY | - |
| dc.contributor.author | Park, IS | - |
| dc.date.accessioned | 2013-03-16T19:31:03Z | - |
| dc.date.available | 2013-03-16T19:31:03Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2001 | - |
| dc.identifier.citation | Proc.3rd Electronic Materials and Packaging, v., no., pp.84 - 87 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/134959 | - |
| dc.language | ENG | - |
| dc.title | Thermo-Mechanical Reliability of the Benzocyclobutane(BCB) film in a WLCSP Process | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 84 | - |
| dc.citation.endingpage | 87 | - |
| dc.citation.publicationname | Proc.3rd Electronic Materials and Packaging | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | Yu, Jin | - |
| dc.contributor.nonIdAuthor | Lee, KO | - |
| dc.contributor.nonIdAuthor | Kim, JY | - |
| dc.contributor.nonIdAuthor | Park, IS | - |
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