DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kyung, Chong-Min | - |
dc.contributor.author | Yim, J.S. | - |
dc.date.accessioned | 2013-03-16T16:16:09Z | - |
dc.date.available | 2013-03-16T16:16:09Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 1999-06 | - |
dc.identifier.citation | 36th Design Automation Conference(DAC), v., no., pp.485 - 490 | - |
dc.identifier.uri | http://hdl.handle.net/10203/133081 | - |
dc.language | ENG | - |
dc.title | Reducing Cross-Coupling among Interconnect Wires in Deep-Submicron Datapath Design | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 485 | - |
dc.citation.endingpage | 490 | - |
dc.citation.publicationname | 36th Design Automation Conference(DAC) | - |
dc.identifier.conferencecountry | United States | - |
dc.identifier.conferencecountry | United States | - |
dc.contributor.localauthor | Kyung, Chong-Min | - |
dc.contributor.nonIdAuthor | Yim, J.S. | - |
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