High Precision Embedded Capacitor Films for Build-Up Substrates Applications
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 백경욱 | - |
| dc.date.accessioned | 2013-03-16T15:14:34Z | - |
| dc.date.available | 2013-03-16T15:14:34Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2002-03 | - |
| dc.identifier.citation | 한국 마이크로 전자 및 패키징학회 2002년도 SMT PCB 기술세미나, v., no., pp.65 - 99 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/132477 | - |
| dc.language | KOR | - |
| dc.publisher | 한국 마이크로 전자 및 패키징학회 | - |
| dc.title | High Precision Embedded Capacitor Films for Build-Up Substrates Applications | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 65 | - |
| dc.citation.endingpage | 99 | - |
| dc.citation.publicationname | 한국 마이크로 전자 및 패키징학회 2002년도 SMT PCB 기술세미나 | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | 백경욱 | - |
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