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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Highly Reliable Flip Chip on Flex Package using Multi-layered Anisotropic Conductive Film

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dc.contributor.authorYim, MJ-
dc.contributor.authorHwang, JS-
dc.contributor.authorKim, JG-
dc.contributor.authorAhn, JY-
dc.contributor.authorKim, HJ-
dc.contributor.authorKwon, WS-
dc.contributor.authorPaik, Kyung-Wook-
dc.date.accessioned2013-03-16T15:14:23Z-
dc.date.available2013-03-16T15:14:23Z-
dc.date.created2012-02-06-
dc.date.issued2002-12-
dc.identifier.citationProceeding of the 3rd International Symposium on Electronic Materials and Packaging 2002, v., no., pp.0 - 0-
dc.identifier.urihttp://hdl.handle.net/10203/132476-
dc.languageENG-
dc.titleHighly Reliable Flip Chip on Flex Package using Multi-layered Anisotropic Conductive Film-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.beginningpage0-
dc.citation.endingpage0-
dc.citation.publicationnameProceeding of the 3rd International Symposium on Electronic Materials and Packaging 2002-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorYim, MJ-
dc.contributor.nonIdAuthorHwang, JS-
dc.contributor.nonIdAuthorKim, JG-
dc.contributor.nonIdAuthorAhn, JY-
dc.contributor.nonIdAuthorKim, HJ-
dc.contributor.nonIdAuthorKwon, WS-
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MS-Conference Papers(학술회의논문)
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