Effects of Cu/Al intermetallic compound (IMC) on copper wire and aluminum pad bondability
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, HJ | ko |
| dc.contributor.author | Lee, YJ | ko |
| dc.contributor.author | Paik, Kyung-Wook | ko |
| dc.contributor.author | Koh, KW | ko |
| dc.contributor.author | Woon, JH | ko |
| dc.contributor.author | Choi, SH | ko |
| dc.contributor.author | Lee, J | ko |
| dc.contributor.author | Moon, JT | ko |
| dc.contributor.author | Park, YJ | ko |
| dc.date.accessioned | 2013-03-16T13:14:39Z | - |
| dc.date.available | 2013-03-16T13:14:39Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2001-11 | - |
| dc.identifier.citation | Proceeding of the 3rd International Symposium on Electronic Matericals and Packaging 2001, pp.44 - 51 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/131632 | - |
| dc.language | English | - |
| dc.publisher | International Symposium on Electronic Matericals and Packaging | - |
| dc.title | Effects of Cu/Al intermetallic compound (IMC) on copper wire and aluminum pad bondability | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000175586500010 | - |
| dc.identifier.scopusid | 2-s2.0-84929618141 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 44 | - |
| dc.citation.endingpage | 51 | - |
| dc.citation.publicationname | Proceeding of the 3rd International Symposium on Electronic Matericals and Packaging 2001 | - |
| dc.identifier.conferencecountry | US | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Kim, HJ | - |
| dc.contributor.nonIdAuthor | Lee, YJ | - |
| dc.contributor.nonIdAuthor | Koh, KW | - |
| dc.contributor.nonIdAuthor | Woon, JH | - |
| dc.contributor.nonIdAuthor | Choi, SH | - |
| dc.contributor.nonIdAuthor | Lee, J | - |
| dc.contributor.nonIdAuthor | Moon, JT | - |
| dc.contributor.nonIdAuthor | Park, YJ | - |
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