The Characteristics of tantalum nitride films Deposited by plasma enhanced atomic layer deposition using hydrogen radical as reduced agent

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dc.contributor.authorKang, Sang-Wonko
dc.date.accessioned2013-03-16T11:57:54Z-
dc.date.available2013-03-16T11:57:54Z-
dc.date.created2012-02-06-
dc.date.issued2001-05-
dc.identifier.citationThe Second Asian Conference on Chemical Vapor Deposition-
dc.identifier.urihttp://hdl.handle.net/10203/131050-
dc.languageEnglish-
dc.publisherAsian Conference on Chemical Vapor Deposition-
dc.titleThe Characteristics of tantalum nitride films Deposited by plasma enhanced atomic layer deposition using hydrogen radical as reduced agent-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationnameThe Second Asian Conference on Chemical Vapor Deposition-
dc.identifier.conferencecountryKO-
dc.identifier.conferencelocationGyeongju, Korea-
dc.contributor.localauthorKang, Sang-Won-
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MS-Conference Papers(학술회의논문)
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