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Analysis of Asymmetric Warpage of Thin Wafers on Flat Plate Considering Bifurcation and Gravitational Force Shin, Dong Kil; Lee, Jungju, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.2, pp.248 - 258, 2014-02 |
Electromagneto-thermo-mechanical behaviors of conductive circular plate subject to time-dependent magnetic fields Gao, Yuanwen; Xu, B; Huh, Hoon, ACTA MECHANICA, v.210, no.1-2, pp.99 - 116, 2010-02 |
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