Browse "Dept. of Mechanical Engineering(기계공학과)" by Subject viscoelasticity

Showing results 1 to 7 of 7

1
A constitutive model and FEA of rubber under small oscillatory load superimposed on large static deformation

Kim, BK; Youn, Sung-Kie; Lee, WS, ARCHIVE OF APPLIED MECHANICS, v.73, no.11-12, pp.781 - 798, 2004-06

2
A three-dimensional nonlinear viscoelastic constitutive model of solid propellant

Jung, GD; Youn, Sung-Kie; Kim, BK, INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, v.37, no.34, pp.4715 - 4732, 2000-08

3
A viscoelastic constitutive model of rubber under small oscillatory load superimposed on large static deformation

Kim, BK; Youn, Sung-Kie, ARCHIVE OF APPLIED MECHANICS, v.71, no.11, pp.748 - 763, 2001-11

4
A viscoelastic constitutive model of rubber under small oscillatory load superimposed on large static deformation considering the Payne effect

Cho, JH; Youn, Sung-Kie, ARCHIVE OF APPLIED MECHANICS, v.75, no.4-5, pp.275 - 288, 2006-02

5
손상을 고려한 고체 추진제의 비선형 점탄성 구성방정식에 관한 연구 = A study on the nonlinear viscoelastic constitutive equation of solid propellant considering damagelink

윤경수; Yun, Kyeong-Soo; et al, 한국과학기술원, 2014

6
정적 대변형 하에서 미소 동적 하중을 받는 고무재료의 점탄성 구성방정식에 관한 연구 = A study on the viscoelastic constitutive behavior of rubber under small-amplitude vibration superimposed on large static deflectionlink

김봉규; Kim, Bong-Kyu; et al, 한국과학기술원, 2002

7
플립칩 본딩에서 무연 솔더의 종방향 열초음파 솔더링에 관한 연구 = A study on longitudinal thermosonic soldering of lead free solder for flip chip bondinglink

이지혜; Lee, Ji-Hye; et al, 한국과학기술원, 2005

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