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Effects of the functional groups of nonconductive films (NCFs) on material properties and reliability of NCF flip-chip-on-organic boards Chung, Chang-Kyu; Kwon, Woon-Seong; Jang, Kyung-Woon; Park, Jin-Flyoung; Lee, Soon-Bok; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.30, no.3, pp.464 - 471, 2007 |
나노 압입자를 이용한 박막/모재 구조의 계면파괴인성치 평가 = Evaluation of interfacial toughness of film/substrate by nanoindenterlink 서병국; Suh, Byung-Guk; et al, 한국과학기술원, 2004 |
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