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Analysis of a short interfacial crack from the corner of a rectangular inclusion Pahn, LO; Earmme, Youn Young, INTERNATIONAL JOURNAL OF FRACTURE, v.106, no.4, pp.341 - 356, 2000-12 |
다층 칩 패키지의 변형 및 균열 해석 = Analysis of deformations and cracks in multi-chip packageslink 박정순; Park, Jeong-Soon; et al, 한국과학기술원, 2006 |
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